Incazelo Yomkhiqizo
Upende we-organic silicon omelana nokushisa okuphezulu, owaziwa nangokuthi upende we-high-temperature, upende omelana nokushisa, uhlukaniswe ngochungechunge lwepende lwe-organic silicon kanye ne-inorganic silicon emelana nokushisa okuphezulu. Upende omelana nokushisa okuphezulu, njengoba igama lisho, uhlobo lopende olungamelana nokugqwala kokushisa okuphezulu kanye nokunye ukugqwala okuphakathi.
- Izinga lokushisa eliphezulu embonini yokugqoka ngokuvamile liphakathi kuka-100°C no-800°C.
- Upende uyadingeka ukuze kugcinwe izakhiwo zomzimba ezizinzile endaweni eshiwo ngenhla: akukho ukuxebuka, akukho ukubhamuka, akukho ukuqhekeka, akukho impuphu, akukho ukugqwala, futhi kuvunyelwe ukuthi kube nokushintsha okuncane kombala.
Isicelo Somkhiqizo
Upende we-silicon ongokwemvelo omelana nokushisa okuphezulu usetshenziswa kabanzi ezindongeni zangaphakathi nezangaphandle zezitofu zokuqhuma kanye nezitofu zokuqhuma ezishisayo, oshimoni, amapayipi omoya, iziteshi zokomisa, amapayipi okukhipha umoya, amapayipi egesi ashisayo ashisa kakhulu, izitofu zokufudumala, izinto zokushintsha ukushisa, kanye nezinye izindawo ezingezona ezensimbi nezensimbi zokuvikela ukugqwala ezishisa kakhulu.
Izinkomba zokusebenza
- Indlela yokuhlola inkomba yephrojekthi
Ukubukeka kwefilimu yokupenda: ukuphela okumnyama okungacwebezeli, ubuso obubushelelezi. GBT1729
Ukuqaqamba (izinkomishi ezi-4 zokumboza): S20-35. GBT1723 Isikhathi sokomisa
Ukomisa itafula ku-25°C, h < 0.5, ngokuhambisana ne-GB/T1728
Ukuqina okuphakathi nendawo ku-25°C, h < 24
Ukomisa ku-200°C, h < 0.5
Amandla okushaya ku-cm50, ngokuvumelana ne-GB/T1732
Ukuguquguquka ku-mm, h < 1, ngokuhambisana ne-GB/T1731
Ibanga lokunamathela, h < 2, ngokuhambisana ne-GB/T1720
Ukucwebezela, okucwebezelayo kancane noma oku-matte
Ukumelana nokushisa (800°C, amahora angama-24): Isembozo sihlala sinjalo, ngokushintsha kombala okuncane okuvunyelwe ngokuhambisana ne-GB/T1735
Inqubo yokwakha
- (1) Ngaphambi kokwelashwa: Ubuso be-substrate kumele buphathwe nge-sandblasting ukuze kufinyelelwe ezingeni le-Sa2.5;
- (2) Sula ubuso bento yokusebenza nge-thinner;
- (3) Lungisa ubungako bengubo ngendwangu ethize ehambisanayo. Indwangu ethize esetshenzisiwe yileyo ethize, futhi umthamo cishe ungaba: wokufutha ngaphandle komoya - cishe u-5% (ngesisindo sokufutha); wokufutha ngomoya - cishe u-15-20% (ngesisindo sokufutha); wokuxubha - cishe u-10-15% (ngesisindo sezinto ezibonakalayo);
- (4) Indlela yokwakha: Ukufutha ngaphandle komoya, ukufutha ngomoya noma ukuxubha. Qaphela: Izinga lokushisa le-substrate ngesikhathi sokwakha kumele libe phezulu kunephuzu lamazolo ngo-3°C, kodwa kungabi ngaphezu kuka-60°C;
- (5) Ukugcoba ngesembozo: Ngemva kokufaka, kuzophola ngokwemvelo ekushiseni kwegumbi bese kusetshenziswa noma komiswe ekamelweni ku-5°C amahora angu-0.5-1.0, bese kufakwa kuhhavini ongu-180-200°C ukuze kubhakwe amahora angu-0.5, kukhishwe bese kupholiswa ngaphambi kokusetshenziswa.
Ezinye izilinganiso zokwakha: Ubuningi - cishe 1.08g/cm3;
Ubukhulu befilimu eyomile (ijazi elilodwa) 25um; Ubukhulu befilimu emanzi 56um;
Iphuzu lokuphazima - 27°C;
Inani lesicelo sokumboza - 120 g/m2;
Isikhathi sokuphumula sokufaka i-coating: amahora angu-8-24 ku-25°C noma ngaphansi, amahora angu-4-8 ku-25°C noma ngaphezulu
Isikhathi sokugcina upende: izinyanga eziyi-6. Ngale kwalesi sikhathi, ingasetshenziswa uma iphumelela ukuhlolwa futhi ifanelekile.
Isikhathi sokuthunyelwe: Septhemba-10-2025
